Abstract In this paper we show how condensation on substrates can induce wetting behavior that is quite different from that of deposited or impinging drops. We describe surfaces with the same wettability in ambient conditions presenting different wetting behavior and growth of droplets in condensation. The experimental results show a rapid spread of droplets and formation of the film on the copper surface, while droplets on SU-8 surface remains on the regular shape while they grow within the time, without coalescence, as observed for Cu. Although the heat conductivity of SU-8 is much lower, due to a difference in wetting behavior, the heat transfer coefficient (h) is higher for dropwise condensation on Cu with a thin layer of SU-8 than filmwise on the bare copper.