Dissolution of Cu into Sn-based solders during reflow soldering

descriptionPublicationkeyboard_double_arrow_right Article 01 Dec 2003 English Publisher:Springer Science and Business Media LLCJournal:Metals and Materials International, volume 9, pages 577-581 (issn: 1598-9623,

Copyright policy )

Authors: Jong-Hyun Lee; Dong-Hyuk Shin; Yong-Seog Kim;

doi: 10.1007/bf03027258

Dissolution of Cu into Sn-based solders during reflow soldering

- Summary
- Metrics

Abstract

Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. Several plausible causes for the excess dissolution of Cu into the solders were explored with experimental observations.

Related Organizations

Hanyang University
Korea (Republic of)
Electronics and Telecommunications Research Institute
Korea (Republic of)
Hongik University
Korea (Republic of)

Impact byBIP!

	selected citations These citations are derived from selected sources. This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).	3
	popularity This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.	Average
	influence This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).	Top 10%
	impulse This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.	Average