Practical methods are described in detail for the construction of tungsten microelectrodes. Straightened 127 μm-diameter tungsten wires are etched to sharp points in KNO2 solution. The sharpened wires are insulated by collapsing borosilicate-glass capillaries onto them in a horizontal pipette puller. A novel technique is described for the removal of insulation from electrode tips by embedding them in a softened bead of solder glass. The bead is then allowed to cool, producing clean fractures of the borosilicate glass at the surface of the bead; the bare, undamaged tip of the electrode is then withdrawn. Electrodes with bare tips from 2 μm to more than 100 μm can be prepared with this method. Finally, the tips are plated with a gold cyanide solution and platinum black. The finished electrodes have tapers of less than 2° and yet are extremely strong. Electrodes with conical plated tips 20 μm long by 6 μm diameter have 1 kHz impedances of less than 1 MΨ.