In this paper we describe the development of a new biaxial loading device for investigating mixed-mode fracture at bimaterial interfaces. The new device makes use of piezoelectric actuators and specially arranged flexures to provide independent displacements normal and tangential to the interface. Capacitive probes and special washer load cells were used for measuring the displacements and reactive loads, respectively. A closed-loop circuit was formed with a personal computer to control the applied displacements to within 10 nm. Preliminary experiments with quartz/epoxy/aluminum sandwich specimens with cracks growing between the quartz and the epoxy found that the intrinsic toughness of this interface was 30% lower than the value for a glass/epoxy interface. Crack opening interferometry measurements having a resolution of 30 nm revealed the presence of a cohesive zone whose size was about 0.5 μm.