The activation areas for grain boundary sliding

descriptionPublicationkeyboard_double_arrow_right Article 01 Oct 1970 English Publisher:Springer Science and Business Media LLCJournal:Journal of Materials Science, volume 5, pages 839-842 (issn: 0022-2461, eissn: 1573-4803,

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Authors: N. Balasubramanian; J. C. M. Li;

doi: 10.1007/bf00574853

The activation areas for grain boundary sliding

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Abstract

The activation areas for grain boundary sliding in Al, Pb, Sn, Zn, and Cu are compared with those for creep in the same materials. It is found that the activation area-stress relation for grain boundary sliding is similar to that for creep. This observation is consistent with a dislocation or ledge mechanism of grain boundary sliding.

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