A process has been developed for diffusion-bonding identical beryllium-copper alloy, 1.8 to 2.0 wt% Be, which has produced bond strengths comparable to that of the bulk. Bonding resulted from self-diffusion between two Be-Cu samples, brought into intimate contact and heated in a high vacuum. Metallurgical analyses of the diffusion bonds revealed the bond interface to be a continuous high-angle planar boundary. The analyses also revealed that oxides were present at the interface after bonding. The agreement between the experimental results and a theoretical model for diffusion-bonding of pure copper, derived by Hill and Wallach, was good.