
doi: 10.1007/bf00293514
The content of total chlorine in o-cresol formaldehyde novolac epoxy resin (CNE), the main resin component for encapsulation formulation, affects the reliability of semi-conductor device greatly and it is one of the major criteria used by the electronic industry in measuring the quality of resins. A new process which synthesizes a high purity CNE with less than 300 ppm total chlorine content has been developed. This high purity resin has provided an extended device life under the accelerated stress test condition.
| selected citations These citations are derived from selected sources. This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically). | 35 | |
| popularity This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network. | Top 10% | |
| influence This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically). | Top 10% | |
| impulse This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network. | Average |
