We present a novel technique to accurately describe the leakage power in CMOS nanometer Integrated Circuits (ICs) considering process variations. The model predicts a leakage power increment due to process variations with high accuracy. It is shown that leakage increases considerably as channel length variations become larger due to technology scaling. The present work also describes accurately the dependence of leakage dispersion with process variations. The model developed shows that, even if channel length variations are kept small the leakage dispersion is considerably large. Finally, the concept of “Hot Gates” (HGs) is introduced, showing that HGs will be an important reliability factor in near future nanometer technologies.