Micro‐transfer printing (μTP) provides fast and precise assembly of micro‐components from a variety of different source materials onto non‐native target substrates such as glass, plastic, ceramic, and silicon. Retrievable micro‐components are picked up by an elastomer stamp and printed onto the target substrate with yields exceeding 99.9%. Devices incorporating GaN, GaAs, InP, and other compound semiconductor materials are successfully integrated onto silicon and glass with fine precision to make highly integrated compound semiconductor micro‐systems.