AbstractThe effects of curing agents n‐octylamine (OA) and m‐xylene diamine (MXDA) on the mechanical and memory properties of E51 epoxy resin (EP) are investigated in this work. The curing mechanism and thermal stability of OA and MXDA with EP are also investigated via Fourier‐transform infrared spectroscopy and thermogravimetric analysis, the influence of curing agent ratios on the thermo‐dynamic mechanical properties of EP are investigated through dynamic thermo‐mechanical analysis, and the relationship between the storage modulus, the hysteresis phase angle and the temperature are constructed. Moreover, the cross‐linking densities of the EP with different curing agent ratios are calculated using Archimedes's method. Besides, the effects of different proportions of curing agents on the mechanical properties of EP are studied. The results show that with the increases of MXDA ratio, the phase transition temperature, crosslink density, recovery temperature, recovery rate, the tensile strength, tensile modulus, strain strength, and strain modulus are enhanced, however, the hysteresis phase angle MXDA ratio and the tenacity decrease. Finally, the shape memory mechanism of E51 is discussed.