AbstractThe temperature coefficient of resistance (TCR) and the humidity coefficient of resistance (HCR) of carbon black (CB) resin thick‐film resistors are influenced by the properties of the CB and resin.This study showed that the curing temperature changes the cohesive state of CB and influences TCR and HCR of the resistor. To confirm the foregoing observation, only one kind of carbon black (CB) and two kinds of glycidylether epoxy resins were used herein.When the resistor was cured at high temperature, TCR changes from positive to negative value. As the curing temperature increased, HCR was improved. It was proved experimentally that the cause of the improvement in HCR is due to the higher cohesion force between CB particles with an increase of the curing temperature.It is shown that CB‐resin type resistors with excellent TCR and HCR can easily be formed by selecting a proper curing condition.