AbstractIn this study, it is aimed to describe the effect of adhesives (PVAc‐polyurethane and urea formaldehyde) on wooden materials (Scotch pine and oriental beech) cut tangentially and radially and layers in laminated veneer lumber (LVL; 3, 4, 5) on thermal conductivity. The lowest thermal conductivity of 0.105 kcal/(m h °C) was obtained in Scotch pine, cut tangentially, bonded with polyurethane, and three‐layer LVL. The highest thermal conductivity of 0.159 kcal/m h °C was obtained in oriental beech, cut radially, bonded with PVAc, and five‐layer LVL. Consequently, oriental beech wood cut radially and bonded with PVAc adhesive and five layers in LVL can be used as a material in construction where the thermal conductivity is required. Scotch pine wood cut tangentially and bonded with polyurethane adhesive and three layers in LVL can be used as a material in construction where the insulation is required. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008