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Article . 2005 . Peer-reviewed
Full-Text: https://www.jstage.jst.go.jp/article/pscjspe/2005A/0/2005A_0_277/_pdf
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Analysis of distribution of material removal rate in CMP process

descriptionPublicationkeyboard_double_arrow_right Article 01 Jan 2005Publisher:Japan Society for Precision EngineeringJournal:Proceedings of JSPE Semestrial Meeting, volume 2005A, pages 277-278
Authors: Suzuki, Norikazu; Hashimoto, Yohei; Shamoto, Eiji;

Analysis of distribution of material removal rate in CMP process

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Keywords

material removal distribution, Chemical mechanical polishing, 化学機械研磨, 研磨レート分布, planarization, 平坦化

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    popularity
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selected citations
These citations are derived from selected sources.
This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Citations provided by BIP!
popularity
This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.
BIP!Popularity provided by BIP!
influence
This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Influence provided by BIP!
impulse
This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.
BIP!Impulse provided by BIP!
0
Average
Average
Average