
The temperature dependence of the specific electrical resistivity, ρ, of the Bi1.9Lu0.1Te3 alloy has been studied within the temperature 2 ÷ 230 K interval. Minimum in the resistivity was found at temperature Tm 11 K. This minimum is originated from a change of conductivity mechanism. Above Tm, the resistivity ρ increases as temperature increases. This behavior is due to the electron mobility decrease via an acoustic phonon scattering at heating. Below Tm, the variable-range hopping conductivity based on electron tunneling takes place. In this case, ρ increases as temperature decreases. Two electric field regimes of the hopping conductivity were observed in the resistivity versus electric field strength dependences.
Electron mobility, Електричний опір, Электрическое сопротивление, Стрибкова провiднiсть, Прыжковая проводимость, Bi1, Physics, QC1-999, Рухливість електронiв, Hopping conductivit, Electrical resistivity, Hopping conductivity, Сплав Bi1.9Lu0.1Te3, 1Te3 alloy, Подвижность электронов, Сплав Bi1, 9Lu0
Electron mobility, Електричний опір, Электрическое сопротивление, Стрибкова провiднiсть, Прыжковая проводимость, Bi1, Physics, QC1-999, Рухливість електронiв, Hopping conductivit, Electrical resistivity, Hopping conductivity, Сплав Bi1.9Lu0.1Te3, 1Te3 alloy, Подвижность электронов, Сплав Bi1, 9Lu0
| selected citations These citations are derived from selected sources. This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically). | 0 | |
| popularity This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network. | Average | |
| influence This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically). | Average | |
| impulse This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network. | Average |
