Sensors are advancing to integrate smart functionalities within the same package to enhance data sensing capabilities. However, implementing in-sensor computing at high temperatures is challenging due to CMOS limitations. To overcome this, we introduce the first demonstration of electromechanical computing using a process flow similar to conventional MEMS sensors, enabling seamless in-MEMS-sensor computing at elevated temperatures. Our approach uses a contactless mechanism, addressing the reliability issues of existing digital circuits based on MEMS relays and ensuring durability under significant temperature fluctuations. We demonstrate NOT logic operation as well as state propagation through a cascade of 10 pipelined gates, paving the way for digital processing within the MEMS sensor's physical layer. Additionally, our devices operate at temperatures up to at least 473 K, opening new possibilities for in-sensor computing in extreme environments.