[EN[:The project objectives are: development of constructive blocks, integrated circuits and multi-standard or multi-physical layer platforms for the future devices, which will have to manage this variety of protocols in an acceptable range to ensure their place in the market; investigating and implementing very low consume solutions, and to contribute to the rising WPAN and WBAN standards, paying special attention to the imminent IEEE standard BAN; developing multi-mode Bluetooth chips and reconfigurable chips, capable of operating over several physical layers foreseen in the family of standards IEEE 802.15; reaching interoperability and coexistence of the developed solutions, by means of the development and evaluation of prototypes over multi-standard tests; and integration and validation of the specific devices for domestic monitorization.

[ES]: Este proyecto propone innovaciones en el diseño de bloques constructivos y chips CMOS para la Capa Física de los estándares IEEE 802.15.4/4a/x y Bluetooth/Bluetooth ULP. Con el objetivo de reducir el consumo se utilizarán las tecnologías más recientes y novedosas, así como métodos de diseño eficiente (co-diseño del front-end de la antena, dispositivos BAW, diseño CMOS de 1V, procesamiento avanzado de señales, etc.).

Proyecto SR2, Ref. TSI-020400-2010-55 (2010-2011), Ministerio de Industria, Turismo y Comercio

VCO and LNA for 2.4GHz communication applications

No