publication . Article . 2009

thermal stress in a bi material assembly with a piecewise continuous bonding layer theorem of three axial forces

E Suhir;
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  • Published: 30 Jan 2009 Journal: Journal of Physics D: Applied Physics, volume 42, page 45,507 (issn: 0022-3727, eissn: 1361-6463, Copyright policy)
  • Publisher: IOP Publishing
Abstract
We consider a bi-material assembly with a 'piecewise-continuous' bonding layer. The layer is characterized by different elastic constants of its 'pieces' (segments) and is assumed to be thin. Young's moduli of all the 'pieces' of the bonding layer are significantly lower than the moduli of the adherend materials. In such a situation the coefficient of thermal expansion (CTE) of the bonding material need not be accounted for. Only the interfacial compliance of the bonding layer is important. This is indeed the case for the majority of electronic, opto-electronic or photonic assemblies. We consider the situation when the assembly is manufactured at an elevated tem...
Subjects
free text keywords: Acoustics and Ultrasonics, Electronic, Optical and Magnetic Materials, Surfaces, Coatings and Films, Condensed Matter Physics, Composite material, Shearing (physics), Analytical chemistry, Young's modulus, symbols.namesake, symbols, Beam (structure), Shear stress, Stress relaxation, Physics, Bending, Creep, Stress (mechanics)
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