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Resúmenes de Mecánica Computacional
Article . 2024 . Peer-reviewed
License: CC BY
Data sources: Crossref
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Modelado de la Soldadura y Manufactura Aditiva con Asistencia por Alambre Caliente (Hot-Wire)

Authors: Fernando B. Sánchez Sarmiento; Patricio F. Méndez;

Modelado de la Soldadura y Manufactura Aditiva con Asistencia por Alambre Caliente (Hot-Wire)

Abstract

Este trabajo presenta un análisis de la deposición por alambre caliente durante soldadura. En esta metodología, el alambre está en contacto con la pieza de trabajo y la corriente se induce de tal manera que el alambre se calienta casi exclusivamente por efecto Joule. Entonces, se produce una combinación tal que la velocidad, la longitud y las propiedades del alambre junto con la corriente generan que el punto de contacto entre el alambre y la pieza alcance la temperatura de fusión. Esta tecnología es ampliamente empleada en la industria nuclear y otras industrias donde los materiales son sensibles al calor aportado. El desafío de este modelado radica en que la resistividad del alambre varia en un orden magnitud entre la temperatura con la que ingresa el alambre y su fusión. Esto se resuelve con un modelo no lineal y el conocimiento detallado del propiedades eléctricas y termo-físicas.

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selected citations
These citations are derived from selected sources.
This is an alternative to the "Influence" indicator, which also reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Citations provided by BIP!
popularity
This indicator reflects the "current" impact/attention (the "hype") of an article in the research community at large, based on the underlying citation network.
BIP!Popularity provided by BIP!
influence
This indicator reflects the overall/total impact of an article in the research community at large, based on the underlying citation network (diachronically).
BIP!Influence provided by BIP!
impulse
This indicator reflects the initial momentum of an article directly after its publication, based on the underlying citation network.
BIP!Impulse provided by BIP!
0
Average
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