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Availability of parts and definition of technologies for wafer-to-wafer hybridization

descriptionPublicationkeyboard_double_arrow_right Other literature type , Project milestone 09 Jan 2023Publisher:ZenodoFunded by:EC | AIDAinnova

Authors: F. Huegging; T. Fritzsch;

doi: 10.5281/zenodo.7515666 , 10.5281/zenodo.7515667

Availability of parts and definition of technologies for wafer-to-wafer hybridization

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Abstract

Within WP6 (Hybrid Pixel Sensors for 4D Tracking and Interconnection Technologies) Milestone MS25 contains the availability of parts and definition of technologies for wafer-to-wafer hybridization. This milestone has been successfully achieved and is reported in this document.

Keywords

WP6

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Funded by

EC| AIDAinnova