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Publication . Article . 2019

Optimization of Arrangement of LED on the PCB for High Power LED Module

Ju Yong Cho; Ho Seob Kim; Won Kweon Jang;
Open Access
Published: 30 Dec 2019 Journal: International Journal of Engineering and Advanced Technology, volume 9, pages 384-387 (eissn: 2249-8958, Copyright policy )
Publisher: Blue Eyes Intelligence Engineering and Sciences Engineering and Sciences Publication - BEIESP
LED operating under high-temperature condition badly affects reliability. To reduce junction temperature of LED is crucial. In this paper, luminous intensity and photo conversion efficient with respect to electrical power are discussed. Moreover, three arrangements for LED module are suggested, and design parameters are discussed in terms of the number of LEDs and distance between each LED. In order to evaluate thermal performance of designed the module, computer simulation was conducted. Distance between each LED is selected by 7.6, 9.6, and 13.3mm for 80, 128, and 240 LEDs, respectively and unit heat flux is calculated to be 0.47W/mm2 , 0.29W/mm2 , 0.16W/mm2 for 80, 128, and 240 LEDs, respectively. In this case, Maximum temperature on the PCB was 67.8C, 62.5C, and 57.1C for 80, 128, and 240 LEDs, respectively. The Maximum temperature and unit heat flux was reduced by 15.7% and 66%, respectively, when the number of LEDs are increased by three times. We found that the temperature between LEDs can be reduced if unit heat flux can be reduced.
Subjects by Vocabulary

Microsoft Academic Graph classification: Materials science High power leds Power (physics) Thermal resistance Heat flux Heat transfer Optoelectronics business.industry business


Computer Science Applications, General Engineering, Environmental Engineering, Thermal resistance, Thermal degradation, High power LEDs, Heat transfer, Heat flux, 2249-8958, B3187129219/2019©BEIESP