
Lowering the flux of sputtered particles using a molybdenum grid reduced the deposition rate of MoS2 films with an enlargement of the grain size measured by in-plane X-ray diffraction. The MoS2 film crystallinity evaluated by the Raman spectroscopy was improved because the S/Mo ratio was also enhanced by the low-rate sputtering. In addition, the enhancement of the grain size was confirmed from plan-view TEM observations of MoS2 films, consistent with the in-plane XRD results. Therefore, reducing the particle flux during sputtering is expected to contribute to the better-quality MoS2 films for pn-stacked 2D-CMOS devices and human interface devices.
grain size, ultra-high vacuum (UHV) radio frequency (RF) magnetron sputtering, low-rate sputtering, molybdenum di-sulfide (MoS₂), Electrical engineering. Electronics. Nuclear engineering, Transition metal di-chalcogenide (TMDC), TK1-9971
grain size, ultra-high vacuum (UHV) radio frequency (RF) magnetron sputtering, low-rate sputtering, molybdenum di-sulfide (MoS₂), Electrical engineering. Electronics. Nuclear engineering, Transition metal di-chalcogenide (TMDC), TK1-9971
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