AbstractThe sub‐Tg relaxations of bisphenol‐A–based thermosets cured with diaminodiphenyl methane and diaminodiphenyl sulfone have been studied by dielectric measurements over the frequency range 12 Hz to 200 kHz from their ungelled or “least” cured states to their fully cured states. Both thermosets show two relaxation processes, γ and β, as the temperature is increased toward their Tgs. In the ungelled states, the γ process is more prominent than the β process. As curing proceeds, the strength of the γ process decreases and reaches a limiting value, while that of the β process initially increases, reaches a maximum value, and then decreases. An increase in the chain iength and the number of crosslinks increases the number of ‐OH dipoles and/or degree of their motions in local regions of the network matrix. This is partly caused by the decreasing efficiency of segmental packing as the curing proceeds. The sub‐Tg relaxations become increasingly more, separated from the α relaxation during curing. Physical aging causes a decrease in the strength of the β relaxation of the thermosets as a result of the collapse of loosely packed regions of low cross‐linking density, and this decrease competes against an increase caused by further crosslinking during the “post‐cure” process.