publication . Article . 2014

Detectors in 3D available for assessment

Re, Valerio;
Open Access English
  • Published: 01 Jan 2014
Abstract
This deliverable reports on 3D devices resulting from the vertical integration of pixel sensors and readout electronics. After 3D integration steps such as etching of through-silicon vias and backside metallization of readout integrated circuits, ASICs and sensors are interconnected to form a 3D pixel detector. Various 3D detectors have been devised in AIDA WP3 and their status and performance is assessed here.
Subjects
ACM Computing Classification System: Hardware_INTEGRATEDCIRCUITSHardware_PERFORMANCEANDRELIABILITY
free text keywords: Detectors and Experimental Techniques, Microelectronics and interconnection technology [3], 3D Interconnection [3.2]
Funded by
EC| AIDA
Project
AIDA
Advanced European Infrastructures for Detectors at Accelerators
  • Funder: European Commission (EC)
  • Project Code: 262025
  • Funding stream: FP7 | SP4 | INFRA
Download from
Powered by OpenAIRE Research Graph
Any information missing or wrong?Report an Issue