publication . Other literature type . Conference object . Article . 2013

Quality Assurance and Functionality Tests on Electrical Components during the ATLAS IBL Production

A Bassalat;
Open Access English
  • Published: 23 Sep 2013
  • Country: France
Abstract
To improve performance of the ATLAS inner tracker, a fourth Pixel layer, called the Insertable B-layer (IBL), will be installed in 2014 on a new beam pipe. A new read out chip generation, FE-I4, has been developed and two different sensor designs, a rather conventional planar and a 3D design, have been flip chipped to these front ends. New staves holding new stave and module flex circuits have been developed as well. Therefore, a production QA test bench has been established to test all production staves before integration with the new beam pipe. This setup combines former ATLAS Pixel services and a new readout system, namely the RCE (Reconfigurable Cluster Elem...
Subjects
free text keywords: Detectors and Experimental Techniques, [PHYS.PHYS.PHYS-INS-DET]Physics [physics]/Physics [physics]/Instrumentation and Detectors [physics.ins-det], Instrumentation, Mathematical Physics, Beam (structure), Test bench, Mechanical engineering, Chip, Computer science, Electronic component, visual_art.visual_art_medium, visual_art, Electrical engineering, business.industry, business, Planar, Cleanroom, Quality assurance, Flexible electronics
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