publication . Article . 2014

Production and characterization of SLID interconnected n-in-p pixel modules with 75 micron thin silicon sensors

Andricek, L; Beimforde, M; Macchiolo, A; Moser, H.G; Nisius, R; Richter, R.H; Terzo, S; Weigell, P;
Open Access English
  • Published: 01 Jan 2014
  • Publisher: Nucl. Instrum. Methods Phys. Res., A
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel...
ACM Computing Classification System: Hardware_INTEGRATEDCIRCUITS
free text keywords: Detectors and Experimental Techniques, Microelectronics and interconnection technology [3], 3D Interconnection [3.2]
Funded by
Advanced European Infrastructures for Detectors at Accelerators
  • Funder: European Commission (EC)
  • Project Code: 262025
  • Funding stream: FP7 | SP4 | INFRA
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