publication . Article . 2013

Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC

R. Fei; Alexandre Rozanov; M. Garcia-Sciveres; D. Fougeron; Marlon Barbero; Jean-Claude Clemens; L. Gonella; Tomasz Hemperek; Norbert Wermes; B. Chantepie; ...
Open Access English
  • Published: 01 Jan 2013
  • Publisher: Nucl. Instrum. Methods Phys. Res., A
Abstract
Abstract 3D technologies are investigated for the upgrade of the ATLAS pixel detector at the HL-LHC. R&D focuses on both, IC design in 3D, as well as on post-processing 3D technologies such as Through Silicon Via (TSV). The first one uses a so-called via first technology, featuring the insertion of small aspect ratio TSV at the pixel level. As discussed in the paper, this technology can still present technical challenges for the industrial partners. The second one consists of etching the TSV via last. This technology is investigated to enable 4-side abuttable module concepts, using today's pixel detector technology. Both approaches are presented in this paper an...
Subjects
ACM Computing Classification System: Hardware_INTEGRATEDCIRCUITSHardware_PERFORMANCEANDRELIABILITY
free text keywords: Detectors and Experimental Techniques, Microelectronics and interconnection technology [3], 3D Interconnection [3.2], Nuclear and High Energy Physics, Instrumentation, Integrated circuit design, Through-silicon via, Etching, Pixel, Physics, Atlas (anatomy), medicine.anatomical_structure, medicine, Large Hadron Collider, Upgrade, Pixel detector, Computer hardware, business.industry, business
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