Status and perspectives of pixel sensors based on 3D vertical integration

Article English OPEN
Re, V;
(2014)
  • Publisher: Nucl. Instrum. Methods Phys. Res., A
  • Subject: Detectors and Experimental Techniques | 3D Interconnection [3.2] | Microelectronics and interconnection technology [3]
    arxiv: Physics::Instrumentation and Detectors

This paper reviews the most recent developments of 3D integration in the field of silicon pixel sensors and readout integrated circuits. This technology may address the needs of future high energy physics and photon science experiments by increasing the electronic funct... View more
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