publication . Preprint . Conference object . 2012

Characterization of an x-ray hybrid CMOS detector with low interpixel capacitive crosstalk

Christopher V. Griffith; Zachary Prieskorn; David N. Burrows; Stephen D. Bongiorno; Abraham D. Falcone;
Open Access English
  • Published: 26 Jul 2012
Abstract
We present the results of x-ray measurements on a hybrid CMOS detector that uses a H2RG ROIC and a unique bonding structure. The silicon absorber array has a 36{\mu}m pixel size, and the readout array has a pitch of 18{\mu}m; but only one readout circuit line is bonded to each 36x36{\mu}m absorber pixel. This unique bonding structure gives the readout an effective pitch of 36{\mu}m. We find the increased pitch between readout bonds significantly reduces the interpixel capacitance of the CMOS detector reported by Bongiorno et al. 2010 and Kenter et al. 2005.
doi: 10.1117/12.925732
Subjects
arXiv: Physics::Instrumentation and Detectors
free text keywords: Astrophysics - Instrumentation and Methods for Astrophysics, Silicon, chemistry.chemical_element, chemistry, Interference (communication), Optoelectronics, business.industry, business, Materials science, CMOS, Capacitive sensing, Detector, Pixel, X-ray, Capacitance
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Preprint . 2012
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http://arxiv.org/pdf/1207.6317...
Conference object
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Conference object
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http://dx.doi.org/10.1117/12.9...
Conference object . 2012
Provider: Crossref

1. S. D. Bongiorno, A. D. Falcone, D. N. Burrows, and R. Cook, \Measurements of Si hybrid CMOS x-ray detector characteristics," in Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series 7742, July 2010. [OpenAIRE]

2. A. T. Kenter, R. Kraft, S. Nulsen, G. Meehan, and S. S. Murray, \Rockwell CMOS hybrid imager as a soft x-ray imaging spectrometer," in Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, O. H. W. Siegmund, ed., Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series 5898, pp. 479{489, Aug. 2005. [OpenAIRE]

3. A. Falcone et al. 2012 (these proceedings)

4. G. Finger, R. Dorn, M. Meyer, L. Mehrgan, A. F. M. Moorwood, and J. Stegmeier, \Interpixel capacitance in large format CMOS hybrid arrays," in Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series 6276, July 2006.

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6. Y. Bai, J. Bajaj, J. W. Beletic, M. C. Farris, A. Joshi, S. Lauxtermann, A. Petersen, and G. Williams, \Teledyne Imaging Sensors: silicon CMOS imaging technologies for x-ray, UV, visible, and near infrared," in Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series, Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series 7021, Aug. 2008.

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