publication . Conference object . 2018

Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels

Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.;
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  • Published: 01 Jan 2018
  • Publisher: IEEE
  • Country: Germany
Abstract
Heat dissipation of integrated circuits is established through the die back-side. In this study, we demonstrate dual-side heat removal from the chip front- and back-side. The key enabling element is a silicon interposer with embedded micro-channels between the through-silicon vias (TSV, array). The coolant is introduced into the module through a manifold and is distributed to the back-side cold plate and in parallel to the fluid cavity in the interposer. A thermal analysis on the stack topology options for a three-tier chip stack (GPU, CPU and cache) with an accumulated power dissipation of 672W is provided. The dual-side cooling approach allows the placement of...
Subjects
free text keywords: Optoelectronics, business.industry, business, Thermal resistance, Microchannel, Engineering, Coolant, Stack (abstract data type), Interposer, Electronic engineering, Dissipation, Integrated circuit, law.invention, law, Chip
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publication . Conference object . 2018

Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels

Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.;