publication . Other literature type . Conference object . 2003

Thermal Management of Transient Power Spikes in Electronics: Phase Change Energy Storage or Copper Heat Sinks??

Shankar Krishnan; Suresh V. Garimella;
Open Access
  • Published: 01 Jan 2003
  • Publisher: Purdue University
  • Country: United States
Abstract
<jats:p>A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper heat sinks. Both the melting of the phase change material under a transient power spike input, as well as the resolidification process, are considered. Phase change materials of different kinds (paraffin waxes and metallic alloys) are considered, with and without the use of thermal conductivity enhancers. Simple expressions for the melt depth, melting time and temperature distribution are presented in terms of the dimensions of the heat sink and the thermophysical ...
Read more
doi: 10.1115/ipack2003-35169
Subjects
free text keywords: Materials science, Energy storage, Copper, chemistry.chemical_element, chemistry, Computer cooling, Electronics, Thermal management of electronic devices and systems, Heat sink, Phase change, Copper in heat exchangers, Nuclear engineering
Related Organizations
Download fromView all 2 versions
Purdue E-Scholar
Other literature type . 2004
Provider: Purdue E-Scholar
https://docs.lib.purdue.edu/cg...
Conference object
Provider: UnpayWall
https://asmedigitalcollection....
Conference object
Provider: Microsoft Academic Graph
http://asmedigitalcollection.a...
Conference object . 2003
Provider: Crossref
Powered by OpenAIRE Research Graph
Any information missing or wrong?Report an Issue