publication . Article . 2002

Liquid-film assisted formation of alumina/niobium interfaces

Sugar, Joshua D.; McKeown, Joseph T.; Marks, Robert A.; Glaeser, Andreas M.;
Open Access English
  • Published: 16 Jun 2002
  • Publisher: eScholarship, University of California
  • Country: Algeria
Abstract
Alumina has been joined at 1400 degrees C using niobium-based interlayers. Two different joining approaches were compared: solid-state diffusion bonding using a niobium foil as an interlayer, and liquid-film assisted bonding using a multilayer copper/niobium/copper interlayer. In both cases, a 127-(mu)m thick niobium foil was used; =1.4-(mu)m or =3-(mu)m thick copper films flanked the niobium. Room-temperature four-point bend tests showed that the introduction of a copper film had a significant beneficial effect on the average strength and the strength distribution. Experiments using sapphire substrates indicated that during bonding the initially continuous copp...
Subjects
free text keywords: ceramic/metal interfaces joining diffusion bonding brazing transient liquid phase bonding transient liquid phase alumina sapphire niobium copper dewetting grain boundary grooving fracture
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