Liquid-film assisted formation of alumina/niobium interfaces

Article English OPEN
Sugar, Joshua D.; McKeown, Joseph T.; Marks, Robert A.; Glaeser, Andreas M.;
(2002)
  • Publisher: eScholarship, University of California
  • Subject: ceramic/metal interfaces joining diffusion bonding brazing transient liquid phase bonding transient liquid phase alumina sapphire niobium copper dewetting grain boundary grooving fracture

Alumina has been joined at 1400 degrees C using niobium-based interlayers. Two different joining approaches were compared: solid-state diffusion bonding using a niobium foil as an interlayer, and liquid-film assisted bonding using a multilayer copper/niobium/copper inte... View more
Share - Bookmark