International Collaboration in Packaging Education: Hands-on System-on-Package (SOP) Graduate Level Courses at Indian Institute of Science and Georgia Tech PRC

Conference object OPEN
Varadarajan, Mahesh; Bhattacharya, Swapan; Doraiswami, Ravi; Rao, Ananda G; Rao, NJ; May, Gary; Conrad, Leyla; Tummala, Rao;
(2005)
  • Publisher: IEEE
  • Subject: Electronic Systems Engineering (Formerly, (CEDT) Centre for Electronic Design & Technology)
    acm: ComputingMilieux_COMPUTERSANDEDUCATION

System-on-Package (SOP) continues to revolutionize the realization of convergent systems in microelectronics packaging. The SOP concept which began at the Packaging Research Center (PRC) at Georgia Tech has benefited its international collaborative partners in education... View more
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