publication . Conference object . Contribution for newspaper or weekly magazine . 2018

Ultra-low swing CMOS transceiver for 2.5-D integrated systems

Vasilis F. Pavlidis; Przemyslaw Mroszczyk;
Open Access
  • Published: 01 Jan 2018
  • Publisher: IEEE
  • Country: United Kingdom
This paper presents the design of a low swing transceiver for chip-to-chip communication in 2.5-D integrated systems using a passive interposer. High speed and low power operation is achieved through a new dynamic low swing tunable transmitter (DLST-TX) and inverter-based tunable receiver (INVT-RX) circuits. The novelty of the proposed solution lies in the digital trimming for PVT corners and random parameter variability allowing significant reduction of the voltage swing down to 120 mV with single ended signaling. The compensation method has negligible impact on the circuit performance and silicon area, not typically achievable by device geometry scaling. The p...
Persistent Identifiers
free text keywords: 2.5-D integration, I/O design, Low swing, digital trimming, mismatch cancellation, passive interposer, /dk/atira/pure/subjectarea/asjc/1700/1708, Hardware and Architecture, /dk/atira/pure/subjectarea/asjc/2200/2208, Electrical and Electronic Engineering, /dk/atira/pure/subjectarea/asjc/2200/2213, Safety, Risk, Reliability and Quality, Transmitter, Swing, Interconnection, Transceiver, CMOS, Electrical engineering, business.industry, business, Electronic circuit, Single-ended signaling, Interposer, Computer science
Related Organizations
Funded by
EC| ExaNoDe
European Exascale Processor Memory Node Design
  • Funder: European Commission (EC)
  • Project Code: 671578
  • Funding stream: H2020 | RIA
FET H2020FET HPC: HPC Core Technologies, Programming Environments and Algorithms for Extreme Parallelism and Extreme Data Applications
FET H2020FET HPC: European Exascale Processor Memory Node Design
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