publication . Article . 2017

Main memory in HPC: do we need more, or could we live with less?

Živanovič, Darko; Pavlovic, Milan; Radulovic, Milan; Shin, Hyunsung; Son, Jongpil; McKee, Sally A.; Carpenter, Paul M.; Radojkovic, Petar; Ayguadé Parra, Eduard;
Open Access English
  • Published: 01 Mar 2017
  • Country: Spain
An important aspect of High-Performance Computing (HPC) system design is the choice of main memory capacity. This choice becomes increasingly important now that 3D-stacked memories are entering the market. Compared with conventional Dual In-line Memory Modules (DIMMs), 3D memory chiplets provide better performance and energy efficiency but lower memory capacities. Therefore, the adoption of 3D-stacked memories in the HPC domain depends on whether we can find use cases that require much less memory than is available now. This study analyzes the memory capacity requirements of important HPC benchmarks and applications. We find that the High-Performance Conjugate G...
Persistent Identifiers
ACM Computing Classification System: Hardware_MEMORYSTRUCTURES
free text keywords: :Informàtica::Arquitectura de computadors [Àrees temàtiques de la UPC], High performance computing, Computer systems organization, Distributed architectures, Hardware, Analysis and design of emerging devices and systems, Memory and dense storage, Memory capacity requirements, High-performance computing, Production HPC applications, HPL, HPCG, Càlcul intensiu (Informàtica)
Related Organizations
Funded by
EC| ExaNoDe
European Exascale Processor Memory Node Design
  • Funder: European Commission (EC)
  • Project Code: 671578
  • Funding stream: H2020 | RIA
FET H2020FET HPC: HPC Core Technologies, Programming Environments and Algorithms for Extreme Parallelism and Extreme Data Applications
FET H2020FET HPC: European Exascale Processor Memory Node Design
Any information missing or wrong?Report an Issue