Isothermal and non-isothermal cure of a tri-functional epoxy resin (TGAP): a stochastic TMDSC study

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Hutchinson, John M. ; Shiravand, Fatemeh ; Calventus Solé, Yolanda ; Fraga Rivas, Iria (2012)
  • Related identifiers: doi: 10.1016/j.tca.2011.11.008
  • Subject: :Enginyeria dels materials::Assaig de materials [Àrees temàtiques de la UPC] | Calorimetry | Resines epoxídiques | Calorimetria | :Enginyeria dels materials::Materials naturals::Resines [Àrees temàtiques de la UPC] | Epoxy resins GEC

The isothermal cure of a highly reactive tri-functional epoxy resin, tri-glycidyl para-amino phenol (TGAP), with diamino diphenyl sulphone (DDS), at two different cure temperatures Tc has been studied by both conventional differential scanning calorimetry (DSC) and b... View more
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