SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft

Conference object OPEN
Mesut InaƧ (2018)
  • Related identifiers: doi: 10.1109/ECTC.2017.153
  • Subject:
    acm: Hardware_INTEGRATEDCIRCUITS | Hardware_ARITHMETICANDLOGICSTRUCTURES | Hardware_PERFORMANCEANDRELIABILITY

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) paper entitled "BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications ".
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