BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications

Conference object English OPEN
Mesut Inaç;
(2018)
  • Publisher: IEEE
  • Related identifiers: doi: 10.1109/ectc.2017.153
  • Subject: [SPI]Engineering Sciences [physics]
    acm: Hardware_INTEGRATEDCIRCUITS | Hardware_ARITHMETICANDLOGICSTRUCTURES | Hardware_PERFORMANCEANDRELIABILITY

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) paper entitled "BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications ".
Share - Bookmark