publication . Conference object . 2018

SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft

Mesut Inaç;
Open Access
  • Published: 17 Jan 2018
Abstract
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) paper entitled "BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications ".
Subjects
ACM Computing Classification System: Hardware_INTEGRATEDCIRCUITSHardware_PERFORMANCEANDRELIABILITYHardware_ARITHMETICANDLOGICSTRUCTURES
Funded by
EC| SUMCASTEC
Project
SUMCASTEC
Semiconductor-based Ultrawideband Micromanipulation of CAncer STEm Cells
  • Funder: European Commission (EC)
  • Project Code: 737164
  • Funding stream: H2020 | RIA
Communities
FET H2020FET OPEN: FET-Open research and innovation actions
FET H2020FET OPEN: Semiconductor-based Ultrawideband Micromanipulation of CAncer STEm Cells
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Conference object . 2018
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