Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules

Doctoral thesis OPEN
Lostetter, Alexander B.;
(1998)
  • Publisher: Virginia Tech
  • Subject: packaging | power electronics | thermal analysis
    acm: Hardware_INTEGRATEDCIRCUITS

High power circuits, those involving high levels of voltages and currents to produce several kilowatts of power, would possess an optimized efficiency when driven at high frequencies (on the order of MHz). Such an approach would greatly reduce the size of capacitive an... View more
Share - Bookmark

  • Download from
    VTechWorks via VTechWorks (Doctoral thesis, 1998)
  • Cite this publication