publication . Thesis . 1998

Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules

Lostetter, Alexander B.;
Open Access
  • Published: 12 May 1998
  • Publisher: Virginia Tech
  • Country: United States
Abstract
High power circuits, those involving high levels of voltages and currents to produce several kilowatts of power, would possess an optimized efficiency when driven at high frequencies (on the order of MHz). Such an approach would greatly reduce the size of capacitive and magnetic components, and thus ultimately reduce the cost of the power electronic circuits. The problem with this strategy in conventional packaging, however, is that at high frequencies, interconnects between the power devices on one board (such as Power MOSFETs or IGBTs) and components on another board (such as the coasting diodes) suffer from severe parasitic effects, thus affecting the overall...
Subjects
ACM Computing Classification System: Hardware_INTEGRATEDCIRCUITS
free text keywords: power electronics, thermal analysis, packaging
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Thesis . 1998
Provider: VTechWorks
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