publication . Article . 2011

the high frequency electrical properties of interconnects on a flexible polyimide substrate including the effects of humidity

McGibney, Eoin; Barton, John; Floyd, Liam; Tassie, Paul; Barrett, John;
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  • Published: 01 Jan 2011 Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 1, pages 4-15 (issn: 2156-3950, eissn: 2156-3985, Copyright policy)
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • Country: Ireland
Abstract
Flexible circuit board materials can be used to advantage in radio frequency and high-speed digital systems but an obstacle to their use is the lack of availability of information on the electrical properties of materials to high frequencies and, in particular, the variation in dielectric constant and loss tangent as a function of frequency. This makes accurate electromagnetic simulation of high frequency flexible interconnects difficult. The variation of the electrical properties of these materials as a function of environmental parameters, such as humidity, is also unknown at higher frequencies. This paper has, using microwave resonators, investigated the elec...
Subjects
free text keywords: Electrical characterization, Flexible substrates, High frequency, Material properties, Dielectric measurements, Electronic measurements, Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, Electronic engineering, Flexible electronics, Dielectric, Dielectric loss, Relative permittivity, Engineering, business.industry, business, Radio frequency, Resonator, Dissipation factor, Permittivity
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publication . Article . 2011

the high frequency electrical properties of interconnects on a flexible polyimide substrate including the effects of humidity

McGibney, Eoin; Barton, John; Floyd, Liam; Tassie, Paul; Barrett, John;