Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM

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De Wolf, Ingrid; Khaled, Ahmad; Kim, Soon-Wook; Beyne, Eric; Kögel, Michael; Brand, Sebastian; Djuric-Rissner, Tatjana; Wiesler, Ingo;
  • Publisher: ASM International

This paper demonstrates the application of GHz-SAM for the detection of local non-bonded regions between micron-sized Cu-pads in a wafer-to-wafer hybrid bonded sample. GHz-SAM is currently the only available non-destructive failure analysis technique that can offer this... View more
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