Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM

Conference object OPEN
De Wolf, Ingrid; Khaled, Ahmad; Kim, Soon-Wook; Beyne, Eric; Kögel, Michael; Brand, Sebastian; Djuric-Rissner, Tatjana; Wiesler, Ingo;
(2018)
  • Publisher: ASM International

This paper demonstrates the application of GHz-SAM for the detection of local non-bonded regions between micron-sized Cu-pads in a wafer-to-wafer hybrid bonded sample. GHz-SAM is currently the only available non-destructive failure analysis technique that can offer this... View more
Share - Bookmark

  • Download from
    Lirias via Lirias (Conference object, 2018)
  • Cite this publication