Automation and Integration in Semiconductor Manufacturing

Part of book or chapter of book English OPEN
Liao, Da-Yin;
(2010)
  • Publisher: InTech

Semiconductor automation originates from the prevention and avoidance of frauds in daily fab operations. As semiconductor technology and business continuously advance and grow, manufacturing systems must aggressively evolve to meet the changing technical and business re... View more
  • References (23)
    23 references, page 1 of 3

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    International SEMATECH (1999). Automated Material Handling System (AMHS) Framework User Requirements Document : Version 1.0, International SEMATECH, 1999

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    Liao, D. (2002). A Management and Control Framework for Prioritized Automated Materials Hnadling Services in 300mm Waer Fourndry. Proceedings of 2002 IEEE International Conference on Systems, Man, and Cybernetics, Hammamet, Tunisia, October 2002 18-23

    Liao, D. (2005). Vehicle Clustering Phenomenon in Automatic Materials Handling Systems in 300mm Semiconductor Manufacturing. Journal of Material Science Forum, Progress on Advanced Manufacture for Micro/Nano Technology 2005, Part 2, December 2005 1129-1134

    Liao, D.; Chang, S. ; Pei, K. & Chang, C. (1996). Daily Scheduling for R&D Semiconductor Fabrication. IEEE Transactions on Semiconductor Manufacturing, Vol. 9, No. 4, November 1996 550-561

    Liao, D. & Fu, H. (2004). A Simulation-Based, Two-Phased Approach for Dynamic OHT Allocation and Dispatching in Large-Scaled 300mm AMHS Management. IEEE Robotics & Automation Magazine, Vol. 11, Issue 3, September 2004 22-32

    Liao, D.; Jeng, M. & Zhou, M. (2007). Application of Petri Nets and Lagrangian Relaxation to Scheduling Automatic Materials Handling Vehicles in 300-mm Semiconductor Manufacturing. IEEE Transactions on Systems, Man, and Cybernets-Part C, July 2007 1-13

    Liao, D. & Tsai, M. (2006). A Quota-Constrained, Speed Control Model for Production Scheduling in Semiconductor Manufacturing. International Journal of Manufacturing Technology and Management, Vol. 9, No. 3/4, 2006 294-308

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