publication . Article . 2013

mathematical and simulation modelling of moisture diffusion mechanism during plastic ic packages disassembly

Peng Mou; Dong Xiang; Guanghong Duan;
Open Access
  • Published: 01 Jan 2013 Journal: Advances in Mechanical Engineering, volume 5, page 928,671 (issn: 1687-8140, eissn: 1687-8140, Copyright policy)
  • Publisher: SAGE Publications
Abstract
Reuse of plastic IC packages disassembled from printed circuit boards (PCBs) has significant environmental benefits and economic value. The interface delamination caused by moisture diffusion is the main failure mode of IC packages during the disassembling process, which greatly reduces the reusability and reliability of disassembled IC packages. Exploring moisture diffusion mechanism is a prerequisite to optimize prebaking processes before disassembling that is an effective way to avoid the interface delamination. To this end, a computational model with variable boundary conditions is developed based on the different combination state of water in IC packages. T...
Subjects
free text keywords: Mechanical Engineering, Reusability, Finite element method, Moisture, Failure mode and effects analysis, Engineering, business.industry, business, Control engineering, Humidity, Reuse, Delamination, Engineering drawing, Printed circuit board, Process engineering, Mechanical engineering and machinery, TJ1-1570
Related Organizations
Powered by OpenAIRE Open Research Graph
Any information missing or wrong?Report an Issue
publication . Article . 2013

mathematical and simulation modelling of moisture diffusion mechanism during plastic ic packages disassembly

Peng Mou; Dong Xiang; Guanghong Duan;