publication . Article . 2017

Epoxy-Based Composite Adhesive Containing Silver Coated Copper Powder: Preparation and Evaluation of Its Electrical Properties

Hamed Rikhtegar; Seyed Jamaleddin Peighambardoust; Abdolreza Mirmohseni;
Open Access Persian
  • Published: 01 Apr 2017 Journal: علوم و تکنولوژی پلیمر, volume 30, issue 1, pages 53-61 (issn: 1016-3255, eissn: 2008-0883, Copyright policy)
  • Publisher: Iran Polymer and Petrochemical Institute
The progress in scientific and technical products and increasing needs for advanced electrical and electronic devices have motivated researchers to investigate new ideas in this field. One of the main challenges in this way is the connection between microchips and other parts of electrical boards. Lead-based alloys, especially tin-lead solders are the conventional materials which have destructive effects on living organisms and the environment. Electrical conductive adhesives, used as replacement for lead-based solders, are composites comprised of a polymer matrix as adhesive material and conductive fillers for conduction of electricity. In this research conduct...
free text keywords: composite, electrical conductive filler, epoxy base adhesive, electrical properties, thermal stability properties, Polymers and polymer manufacture, TP1080-1185
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