Effects of Temperature and Slice Thickness on Drying Kinetics of Pumpkin Slices

Article English OPEN
  • Publisher: Walailak University
  • Journal: Walailak Journal of Science and Technology (issn: 1686-3933, eissn: 2228-835X)
  • Publisher copyright policies & self-archiving
  • Related identifiers: doi: 10.2004/wjst.v8i2.23
  • Subject: Pumpkin | convective drying | drying kinetics | effective moisture diffusivity | activation energy | Technology (General) | T1-995 | Science (General) | Q1-390

Dried pumpkin slice is an alternative crisp food product. In this study, the effects of temperature and slice thickness on the drying characteristics of pumpkin were studied in a lab-scale tray dryer, using hot air temperatures of 55, 60 and 65 °C and 2, 3 and 4 mm slic... View more
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