publication . Article . 2016

CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве

Trofimov V. E.; Pavlov A. L.; Mokrousova E. A.;
Open Access
  • Published: 01 Dec 2016 Journal: Технология и конструирование в электронной аппаратуре (issn: 2225-5818, eissn: 2309-9992, Copyright policy)
  • Publisher: Private Enterprise, Politehperiodika
Abstract
One of the final stages of microprocessors development is heat test. This procedure is performed on a special stand, the main element of which is the switching PCB with one or more mounted microprocessor sockets, chipsets, interfaces, jumpers and other components which provide various modes of microprocessor operation. The temperature of microprocessor housing is typically changed using thermoelectric module. The cold surface of the module with controlled temperature is in direct thermal contact with the microprocessor housing designed for cooler installation. On the hot surface of the module a radiator is mounted. The radiator dissipates the cumulative heat flo...
Subjects
free text keywords: CFD-modeling, radiator, heat resistance, impact jet, microprocessor., microprocessor, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

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2. Spokoiny M., Trofimov V., Qiu Х., Kerner J.M. Enhanced heat transfer in a channel with combined structure of pins and dimples // Proc. of the 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, San Francisco, CA, USA, 2006, pp. 1-21.

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publication . Article . 2016

CFD-моделирование радиатора для воздушного охлаждения микропроцессоров в ограниченном пространстве

Trofimov V. E.; Pavlov A. L.; Mokrousova E. A.;