publication . Article . 2015

prediction of grain deformation in drawn copper wire

Chang Chao-Cheng; Wang Zi-Wei; Huang Chien-Kuo; Wu Hsu-Fu;
Open Access
  • Published: 01 Jan 2015 Journal: MATEC Web of Conferences, volume 21, page 2,009 (eissn: 2261-236X, Copyright policy)
  • Publisher: EDP Sciences
Abstract
Most copper wire is produced using a drawing process. The crystallographic texture of copper wire, which is strongly associated with grain deformation, can have a profound effect on the formability and mechanical and electrical properties. Thus, the ability to predict grain deformation in drawn copper wire could help to elucidate the evolution of microstructure, which could be highly valuable in product design. This study developed a novel method for predicting grain deformation in drawn copper wire based on finite element simulation with flow net analysis. Simple upsetting tests were conducted to obtain flow stress curves for the simulation of the drawing proce...
Subjects
free text keywords: Microstructure, Flow net, Copper wire, Formability, Finite element simulation, Metallurgy, Materials science, Deformation (mechanics), Flow stress, Transverse plane, Engineering (General). Civil engineering (General), TA1-2040
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