Prediction of grain deformation in drawn copper wire

Article English OPEN
Chang Chao-Cheng ; Wang Zi-Wei ; Huang Chien-Kuo ; Wu Hsu-Fu (2015)
  • Publisher: EDP Sciences
  • Journal: MATEC Web of Conferences (issn: 2261-236X)
  • Related identifiers: doi: 10.1051/matecconf/20152102009
  • Subject: Engineering (General). Civil engineering (General) | TA1-2040

Most copper wire is produced using a drawing process. The crystallographic texture of copper wire, which is strongly associated with grain deformation, can have a profound effect on the formability and mechanical and electrical properties. Thus, the ability to predict grain deformation in drawn copper wire could help to elucidate the evolution of microstructure, which could be highly valuable in product design. This study developed a novel method for predicting grain deformation in drawn copper wire based on finite element simulation with flow net analysis. Simple upsetting tests were conducted to obtain flow stress curves for the simulation of the drawing process. Predictions related to grain deformation were compared with those on the micrographs of the drawn copper wire obtained in experiments. In longitudinal and transverse cross-sections of the drawn wire, the predicted and experiment results presented similar trends involving considerable deformation within the grains. This preliminary study demonstrates the efficacy of the proposed method in providing information useful to the prediction of the grain deformation in drawn copper wire.
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