Prediction of grain deformation in drawn copper wire

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Chang Chao-Cheng; Wang Zi-Wei; Huang Chien-Kuo; Wu Hsu-Fu;
  • Publisher: EDP Sciences
  • Journal: MATEC Web of Conferences (issn: 2261-236X)
  • Related identifiers: doi: 10.1051/matecconf/20152102009
  • Subject: Engineering (General). Civil engineering (General) | TA1-2040

Most copper wire is produced using a drawing process. The crystallographic texture of copper wire, which is strongly associated with grain deformation, can have a profound effect on the formability and mechanical and electrical properties. Thus, the ability to predict g... View more
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