Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

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Zhuhao Gong ; Yulong Zhang ; Xin Guo ; Zewen Liu (2018)
  • Publisher: MDPI AG
  • Journal: Micromachines (issn: 2072-666X)
  • Related identifiers: doi: 10.3390/mi9030093
  • Subject: wafer-level packaging | adhesive bonding | photosensitive BCB | RF MEMS | Mechanical engineering and machinery | TJ1-1570

A radio-frequency micro-electro-mechanical system (RF MEMS) wafer-level packaging (WLP) method using pre-patterned benzo-cyclo-butene (BCB) polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this pro... View more
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