publication . Article . 2018

Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

Zhuhao Gong; Yulong Zhang; Xin Guo; Zewen Liu;
Open Access English
  • Published: 01 Feb 2018 Journal: Micromachines, volume 9, issue 3 (issn: 2072-666X, eissn: 2072-666X, Copyright policy)
  • Publisher: MDPI
Abstract
A radio-frequency micro-electro-mechanical system (RF MEMS) wafer-level packaging (WLP) method using pre-patterned benzo-cyclo-butene (BCB) polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this process, the BCB polymer was pre-defined to form the sealing ring and bonding layer by the spin-coating and patterning of photosensitive BCB before the cavity formation. During anisotropic wet etching of the silicon wafer to generate the housing cavity, the BCB sealing ring was protected by a sputtered Cr/Au (chromium/gold) layer. The average measured thickness of the BCB layer was 5.9 μm. In contras...
Subjects
free text keywords: RF MEMS, Mechanical engineering and machinery, TJ1-1570, wafer-level packaging, photosensitive BCB, adhesive bonding, Article
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publication . Article . 2018

Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

Zhuhao Gong; Yulong Zhang; Xin Guo; Zewen Liu;