Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer
- Publisher: MDPI AG
wafer-level packaging | adhesive bonding | photosensitive BCB | RF MEMS | Mechanical engineering and machinery | TJ1-1570
A radio-frequency micro-electro-mechanical system (RF MEMS) wafer-level packaging (WLP) method using pre-patterned benzo-cyclo-butene (BCB) polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this pro...