Wafer-Level Vacuum Packaging of Smart Sensors

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Hilton, Allan; Temple, Dorota S.;
  • Publisher: MDPI AG
  • Journal: Sensors,volume 16,issue 11 (issn: 1424-8220, eissn: 1424-8220)
  • Publisher copyright policies & self-archiving
  • Related identifiers: doi: 10.3390/s16111819, pmc: PMC5134478
  • Subject: AuSn | wafer-level vacuum packaging | CuSn | AlGe | solid-liquid interdiffusion (SLID) bonding | TP1-1185 | metal-metal bonding | AuSi | hermetic packaging | wafer-to-wafer bonding | smart sensors | microelectromechanical (MEMS) | AuIn | eutectic bonding | Review | Chemical technology | thin-film getter

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integrat... View more
  • References (173)
    173 references, page 1 of 18

    Shanklin, T.A.. CERIAS Tech Report 2012-07, an Agent-Based Model for Navigation Simulation in a Heterogeneous Environment.

    Fischer, A.C., Forsberg, F., Lapisa, M., Bleiker, S.J., Stemme, G., Roxhed, N., Niklaus, F.. Integrating MEMS and ICs. Microsyst. Nanoeng.. 2015; 1: 15005

    Pelzer, R., Kirchberger, H., Kettner, P.. Wafer-to-Wafer Bonding Techniques: From MEMS Packaging to IC Integration Applications. Proceedings of the 2005 6th International Conference on Electronic Packaging Technology. : 1-6

    Knechtel, R.. Aspects of bonding processed CMOS wafers. ECS Trans.. 2008; 16: 39-46

    Hausner, R.. Wafer-bonding for MEMS—Status and trends. ECS Trans.. 2014; 64: 245-251

    Lapisa, M., Stemme, G., Niklaus, F.. Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS. IEEE J. Sel. Top. Quantum Electron.. 2011; 17: 629-644

    Niklaus, F., Lapisa, M., Bleiker, S.J., Dubois, V., Roxhed, N., Fischer, A.C., Forsberg, F., Stemme, G., Grogg, D., Despont, M.. Wafer-level heterogeneous 3D integration for MEMS and NEMS. Proceedings of the 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). : 247-252

    Kuisma, H.. Introduction to Encapsulation of MEMS-Chapter Thirty. 2010: 501-504

    Esashi, M.. Wafer level packaging of MEMS. J. Micromech. Microeng.. 2008; 18: 073001

    Dragoi, V., Pabo, E.. Wafer bonding technology for new generation vacuum MEMS: Challenges and promises. Proceedings of the Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems.

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