Wafer-Level Vacuum Packaging of Smart Sensors

Article English OPEN
Hilton, Allan; Temple, Dorota S.;
(2016)
  • Publisher: MDPI AG
  • Journal: Sensors,volume 16,issue 11 (issn: 1424-8220, eissn: 1424-8220)
  • Publisher copyright policies & self-archiving
  • Related identifiers: doi: 10.3390/s16111819, pmc: PMC5134478
  • Subject: AuSn | wafer-level vacuum packaging | CuSn | AlGe | solid-liquid interdiffusion (SLID) bonding | TP1-1185 | metal-metal bonding | AuSi | hermetic packaging | wafer-to-wafer bonding | smart sensors | microelectromechanical (MEMS) | AuIn | eutectic bonding | Review | Chemical technology | thin-film getter
    acm: Hardware_INTEGRATEDCIRCUITS | Hardware_PERFORMANCEANDRELIABILITY

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integrat... View more
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