publication . Preprint . Other literature type . Conference object . Article . 2014

Achievements of the ATLAS Upgrade Planar Pixel Sensors R&D Project

G. Calderini;
Open Access English
  • Published: 07 Sep 2014
  • Country: France
Abstract
Comment: 11 pages, 9 figures, PSD10: 10th International Conference on Position Sensitive Detectors. Updated from minor revisions requested from referee
Subjects
free text keywords: Physics - Instrumentation and Detectors, Detectors and Experimental Techniques, Large detector systems for particle and astroparticle physics, Radiation-hard detectors, Particle tracking detectors, [PHYS.HEXP]Physics [physics]/High Energy Physics - Experiment [hep-ex], [PHYS.PHYS.PHYS-INS-DET]Physics [physics]/Physics [physics]/Instrumentation and Detectors [physics.ins-det], High Energy Physics - Experiment, Instrumentation, Mathematical Physics, Advanced infrastructures for detector R&D [9], Precision Pixel Detectors [9.3], physics.ins-det, Nuclear and High Energy Physics, Physics, Planar, Coping (joinery), ATLAS experiment, Detector, Atlas (anatomy), medicine.anatomical_structure, medicine, Pixel, Upgrade, Computer hardware, business.industry, business, Electrical engineering, Computer graphics (images), Atlas upgrade, Optoelectronics
Funded by
EC| AIDA
Project
AIDA
Advanced European Infrastructures for Detectors at Accelerators
  • Funder: European Commission (EC)
  • Project Code: 262025
  • Funding stream: FP7 | SP4 | INFRA

193 231 [1] G. Calderini et al., Nucl.Instrum.Meth. A636 (2011) S37-S41. 232 [2] G. Casse et al., DA AGGIUNGERE 233 [3] VTT Technical Research Centre of Finland, P.O. Box 1000, FI-02044 234 VTT, Finland; http://www.vtt.fi 235 [4] A. Macchiolo et al., ”Thin n-in-p pixel sensors and the SLID-ICV verti236 cal integration technology for the ATLAS upgrade at the HL-LHC”, Pro237 ceedings for Pixel 2012 Conference, Nucl. Instr. and Meth. A, in press, 238 http://arxiv.org/abs/1210.7933

Figure 13: Detail of the metal biasing scheme for a sensor with 50x250 m239 [5] Fondazione Bruno Kessler, Centro per i Materiali e i Microsistemi (FBK-

pixels designed by the ATLAS Dortmund group and produced by CiS. Di erent240 CMM) Povo di Trento (TN), Italy. http://www.fbk.eu

geometry designs have been tested to optimise the sensor performance. 241 [6] M. Bomben et al., Nucl. Instrum. and Meth. A 712, 41 (2013). 242 [7] G. Calderini et al., Development of edgeless Silicon pixel sensors on p243 type substrate for the ATLAS High-Luminosity upgrade, Proceedings for

6. Bulk materials 244 9th HSTD Hiroshima 2013 Conference, Nucl. Instrum. and Meth. A, in 245 press, http://arxiv.org/abs/xxxx.xxxx Special mention needs to be done for a recent study by the246 [8] M. Garcia-Sciveres, D. Arutinov, M. Barbero, et al. The FE-I4 pixel read-

ATLAS Dortmund group, which is trying to improve the radia-247 out integrated circuit - 2011. Nucl.Instrum.Meth., A636, 155

tion hardness of n-in-n sensors by the use of a MCz bulk. The248 [9] Santa Cruz Institute for Particle Physics (SCIPP), University of California 249 Santa Cruz, USA.

intermediate layers of the upgraded ATLAS tracker will be ex-250 [10] U.S. Naval Research Laboratory, 4555 Overlook Ave., SW Washington,

posed to a mix of ionising and non-ionising radiation. MCz ma-251

terial is expected to have a better performance with respect to252

standard DOFZ bulk under these conditions [19]. For this rea-253 254

son, MCz FE-I4-design prototype sensors have been produced255

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