Efficient Substrate Noise Coupling Verification and Failure Analysis Methodology for Smart Power ICs in Automotive Applications

Article English OPEN
Moursy, Yasser; Zou, Hao; Khalil, Raouf; Iskander, Ramy; Tisserand, Pierre; Ton, Dieu-My; Pasetti, Giuseppe; Louërat, Marie-Minerve;
(2016)
  • Publisher: Institute of Electrical and Electronics Engineers
  • Related identifiers: doi: 10.1109/TPEL.2016.2604818
  • Subject: DC-DC power conversion | [SPI.TRON]Engineering Sciences [physics]/Electronics | Semiconductor device modeling | Semiconductor device noise | [ SPI.TRON ] Engineering Sciences [physics]/Electronics | Power FET switches | Failure analysis
    acm: Hardware_INTEGRATEDCIRCUITS | Hardware_PERFORMANCEANDRELIABILITY

International audience; This paper presents a methodology to analyze the substrate noise coupling and reduce their effects in smart power integrated circuits. This methodology considers the propagation of minority carriers in the substrate. Hence, it models the lateral ... View more
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