A Study of Polycrystalline Silicon Damage Features Based on Nanosecond Pulse Laser Irradiation with Different Wavelength Effects
- Publisher: MDPI AG
(issn: 1996-1944, eissn: 1996-1944)
QC120-168.85 | laser wavelength | Engineering (General). Civil engineering (General) | Technology | polysilicon | Article | TA1-2040 | T | thermal shock | laser damage | Electrical engineering. Electronics. Nuclear engineering | TK1-9971 | Microscopy | QH201-278.5 | Descriptive and experimental mechanics
Based on PVDF (piezoelectric sensing techniques), this paper attempts to study the propagation law of shock waves in brittle materials during the process of three-wavelength laser irradiation of polysilicon, and discusses the formation mechanism of thermal shock failure. The experimental results show that the vapor pressure effect and the plasma pressure effect in the process of pulsed laser irradiation lead to the splashing of high temperature and high density melt. With the decrease of the laser wavelength, the laser breakdown threshold decreases and the shock wave is weakened. Because of the pressure effect of the laser shock, the brittle fracture zone is at the edge of the irradiated area. The surface tension gradient and surface shear wave caused by the surface wave are the result of coherent coupling between optical and thermodynamics. The average propagation velocity of laser shock wave in polysilicon is 8.47 × 103 m/s, and the experiment has reached the conclusion that the laser shock wave pressure peak exponentially distributes attenuation in the polysilicon.